JPH031410Y2 - - Google Patents
Info
- Publication number
- JPH031410Y2 JPH031410Y2 JP1986199584U JP19958486U JPH031410Y2 JP H031410 Y2 JPH031410 Y2 JP H031410Y2 JP 1986199584 U JP1986199584 U JP 1986199584U JP 19958486 U JP19958486 U JP 19958486U JP H031410 Y2 JPH031410 Y2 JP H031410Y2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- electronic component
- tape
- component
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986199584U JPH031410Y2 (en]) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986199584U JPH031410Y2 (en]) | 1986-12-27 | 1986-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63107964U JPS63107964U (en]) | 1988-07-12 |
JPH031410Y2 true JPH031410Y2 (en]) | 1991-01-17 |
Family
ID=31161346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986199584U Expired JPH031410Y2 (en]) | 1986-12-27 | 1986-12-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH031410Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58182499U (ja) * | 1982-05-31 | 1983-12-05 | 日本電気ホームエレクトロニクス株式会社 | シ−ケンサ用テ−プ |
-
1986
- 1986-12-27 JP JP1986199584U patent/JPH031410Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63107964U (en]) | 1988-07-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS59146775U (ja) | 加速度センサ− | |
JPH031410Y2 (en]) | ||
JPS6074491A (ja) | 回路盤のスチフナおよび回路盤を硬化する方法 | |
JPH0239968Y2 (en]) | ||
JPH0472789A (ja) | フレキシブルプリント基板の取付構造 | |
JPH0341486Y2 (en]) | ||
JP2545968Y2 (ja) | 電子回路基板に垂直に実装されたコンデンサの支え | |
JP2740500B2 (ja) | 電子部品テーピング構造 | |
JPS621101Y2 (en]) | ||
JP3093292U (ja) | ディスク装置 | |
JPS6084979U (ja) | 銘板取付構造 | |
JPH0528121Y2 (en]) | ||
JPH0543486Y2 (en]) | ||
JPS6027137U (ja) | ドレ−ン材用アンカ−板 | |
JPH0527680Y2 (en]) | ||
JPH0220506B2 (en]) | ||
JPS5815367U (ja) | 発光素子 | |
JPH0316312Y2 (en]) | ||
JPS5919730U (ja) | 構築用枠組下地材 | |
JPH05149968A (ja) | 半導体センサ | |
JPS615882U (ja) | エレベ−タ乗場の敷居装置 | |
JPS6087924U (ja) | サンル−ム又は温室等の構造物における屋根部の取付装置 | |
JPS60138920U (ja) | 建築用板材 | |
JPS5863790U (ja) | 印刷配線板装着ガイドレ−ル | |
JPS59166497U (ja) | テ−ピングパツケ−ジ |